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International Symposium on Electronic Materials and Packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong

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索取号：TN305.94-53/E20101
作者：EMAP2000 (2000 : Hong Kong、 China)、Hong Kong University of Science and Technology. Dept. of Mechanical Engineering.、EPACK LAB.、Institute of Electrical and Electronics Engineers.、Components、 Packaging & Manufacturing Technology Society. Hong Kong Chapter.、
出版社：Piscataway, N.J. : IEEE, c2000.