大拱桥--暨南大学学生门户 » 图书馆 » 封装及散热问题 » International Symposium on Electronic Materials and Packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong
| 名称 | International Symposium on Electronic Materials and Packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong | |
| 索引号 | TN305.94-53/E20101 | |
| 分类号 | TN305.94-53 TN305.94(封装及散热问题) TN305(半导体器件制造工艺及设备) TN30(一般性问题) TN3(半导体技术) TN(无线电电子学、电信技术) T(工业技术) |
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| 作者 | EMAP2000 (2000 : Hong Kong、 China)、Hong Kong University of Science and Technology. Dept. of Mechanical Engineering.、EPACK LAB.、Institute of Electrical and Electronics Engineers.、Components、 Packaging & Manufacturing Technology Society. Hong Kong Chapter.、 | |
| 出版社 | Piscataway, N.J. : IEEE, c2000. | |
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| 页数 | xii, 478 p. : ill. ; 30 cm. | |
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